Flat, insulating, thermally stable ceramic substrates for electronics and sensors.
Aluminium nitride substrates are used where heat flux is the limiting factor, in IGBT modules, RF power devices and high-brightness LED arrays. Thickness held to ±0.02 mm, camber under 0.1%.
View component →Silicon nitride substrates are the choice for power modules that cycle hard, such as traction and automotive inverters. Thickness held to ±0.02 mm, camber under 0.1%.
View component →Alumina substrates are the default carrier for thick film and general power circuits. Thickness held to ±0.02 mm, camber under 0.1%.
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